High-Quality Wedge Bonding Solutions from Trusted Factory Supplier

SBT Ultrasonic Technology Co., Ltd. offers advanced Wedge Bonding solutions for various electronic applications. Wedge bonding is a semiconductor assembly process that is used to make interconnections between a chip and the package. Our wedge bonding machines use ultrasonic energy to bond the wire to the semiconductor, ensuring a reliable and precise connection, Our wedge bonding technology provides numerous benefits, including superior bond strength, excellent thermal and electrical conductivity, and the ability to bond on a wide variety of materials. Additionally, our machines are equipped with advanced features such as automatic wire threading, programmable bonding parameters, and easy-to-use interfaces, making them ideal for high-volume production environments, We also offer customization options to meet the specific bonding requirements of our customers. From automotive and aerospace industries to consumer electronics and medical devices, our wedge bonding solutions are trusted by leading manufacturers around the world, With SBT Ultrasonic Technology Co., Ltd., you can expect high-quality wedge bonding machines that deliver unparalleled performance and reliability for your semiconductor bonding needs