Wafer-Level Scanning Acoustic Microscope

Wafer-Level Scanning Acoustic Microscope-High-Resolution NDT Inspection for Advanced Semiconductor Packaging

Engineered for precision and reliability, our Wafer-Level Scanning Acoustic Microscope (SAM) delivers non-destructive subsurface imaging for advanced semiconductor manufacturing, wafer-level packaging (WLP), and MEMS devices. Utilizing high-frequency ultrasonic waves, this system accurately detects micro-defects—such as internal delamination, voids, micro-cracks, and bonding anomalies—without damaging the sample.

The fully automated acoustic microscopes from the Auto SAM Wafer 304 enable fast detection of cavities, voids, bubbles, inclusions, and delamination and are ideally suitable for wafer inspection, bond checking, and MEMS inspection. An automatic defect-review software package performs a fully automated evaluation of the entire wafer.