Ultrasonic Wire Bonder

The SBT Ultrasonic Dual-Head Aluminum Wire Bonder is designed for efficient, high-quality wire bonding in power semiconductor and module assembly. Featuring two independent bonding heads, it significantly improves throughput while maintaining precise and consistent connections for aluminum wire. Ultrasonic technology ensures strong, reliable bonds without excessive heat, protecting sensitive components. Ideal for production environments requiring both speed and repeatability, this system delivers stable performance for heavy aluminum wire sizes commonly used in automotive, industrial, and power electronics applications.

SBT ULTRASONIC is the leading company in China specializing in wire and ribbon bonding for power semiconductors and automotive power modules. We help you overcome numerous technical challenges in electronics applications while simultaneously reducing costs.
Our SBT Copper Wire Bonder utilizes ultrasonic technology to bond round copper wires with diameters ranging from 200 to 500μm (8-20 mils), as well as copper ribbons up to 80 x 8 mils in size.
For over 17 years, SBT ULTRASONIC welding machines have been recognized for exceptional performance, reliability, and excellent after-sales support. SBT Wire Bonders are created to cater to industries' needs of smaller, thinner, and denser semiconductor packages.
All the core components, such as transducers and generators, can be independently developed by ourselves.

SBT ULTRASONIC is the leading company in China specializing in wire and ribbon bonding for power semiconductors and automotive power modules. We help you overcome numerous technical challenges in electronics applications while simultaneously reducing costs.
Our SBT Copper Wire Wedge Bonder utilizes ultrasonic technology to bond round copper wires with diameters ranging from 200 to 500μm (8-20 mils), as well as copper ribbons up to 80 x 8 mils in size.
For over 17 years, SBT ULTRASONIC welding machines have been recognized for exceptional performance, reliability, and excellent after-sales support. SBT Wire Bonders are created to cater to industries' needs of smaller, thinner, and denser semiconductor packages.

SBT ULTRASONIC is the leading company in China specializing in wire and ribbon bonding for power semiconductors and automotive power modules. We help you overcome numerous technical challenges in electronics applications while simultaneously reducing costs.

Our SBT Copper Wire Bonder utilizes ultrasonic technology to bond round copper wires with diameters ranging from 200 to 500μm (8-20 mils), as well as copper ribbons up to 80 x 8 mils in size.

For over 17 years, SBT ULTRASONIC welding machines have been recognized for exceptional performance, reliability, and excellent after-sales support. SBT Wire Bonders are created to cater to industries' needs of smaller, thinner, and denser semiconductor packages.