As advanced packaging technologies evolve toward larger formats and higher integration, quality control becomes exponentially more challenging.
As AI, HBM, and 2.5D/3D heterogeneous integration accelerate, high-precision packaging & inspection equipment are more critical than ever. Join 𝐒𝐁𝐓 𝐔𝐥𝐭𝐫𝐚𝐬𝐨𝐧𝐢𝐜 at 𝐈𝐂𝐄𝐏𝐓 𝟐𝟎𝟐𝟔 as we unveil our latest innovations.
We cordially invite global customers, partners, and industry experts to visit our booths. Come explore how our innovative ultrasonic welding and intelligent monitoring solutions can empower your production and drive a sustainable future!
SBT Ultrasonic sincerely welcomes worldwide customers and industry partners to visit our booth at the 18th China International Battery Fair.