English
Vietnamese Uzbek Thai Persian Mongolian Malay Filipino Dutch Hindi Polish Indonesian Italian Turkish Greek Arabic Korean Japanese Russian Spanish Portuguese German French Chinese Traditional English
Chinese
Leave Your Message
Standard Scanning Acoustic Microscope
Standard Scanning Acoustic Microscope
Scanning Acoustic Microscope_1.jpg
Scanning Acoustic Microscope_2.jpg
Scanning Acoustic Microscope_3.jpg

Standard Scanning Acoustic Microscope

Engineered for reliability and precision, the SBT Ultrasonic Standard SAM provides industry-leading non-destructive ultrasonic imaging for microelectronics, materials science, and quality control.

High-Resolution Acoustic Imaging: Easily detects internal micro-defects, cracks, and bonding failures.

Non-Destructive Testing (NDT): Evaluates internal structures without altering or damaging the sample.

User-Friendly Workflow: Streamlined software interface for rapid scanning, data analysis, and high-throughput inspection.

    Contact Us
    Product Details
    Product Tags

    INTRODUCTION

    The SBT Ultrasonic's Standard SAM is a premier non-destructive failure analysis tool optimized for semiconductor packaging, power modules, and advanced material inspection. Combining precise acoustic transducers with high-speed scanning mechanics, it provides high-contrast, sub-surface visual data to pinpoint delamination, voids, and structural integrity issues. Achieve superior quality control and failure analysis with a system built for accuracy and repeatability.

    FEATURES

    Scanning Acoustic Microscope_2
    01
    Standard Model
    Non-destructive testing enabling efficient, repeatable inspections
    Rapid scanning speed and high detection precision
    Layered scanning capabilities of up to 1,000 layers

    APPLICATIONS

    Layering Inspection for IGBT and SiC Modules
    Layering Inspection for Semiconductor Chip Packaging
    Inspection of 6-inch, 8-inch, and 12-inch Wafers (Including Wafer Bonding)
    Thickness Measurement and Internal Defect Inspection for Diamond Materials
    Inspection for Welding Defects in Cold Plates Heat Sinks

    PARAMETERS

    Dimensions 1200㎜*1500㎜*2000㎜
    Tank Size 675㎜*1500㎜*150㎜, customizable
    Probe Configuration 1 Probe, 2 Probes, 4 Probes
    Maximum Scanning Speed 2000㎜/s
    Resolution 1～4000 μm
    Auto Loading and Unloading √
    Auto Inspection √
    AI Automatic Defect-review Software √