Scanning Acoustic Microscope

Scanning Acoustic Microscope by SBT Ultrasonic Technology CO., LTD is a leading-edge NDE tool. It uses high-frequency ultrasound to detect internal material flaws non-invasively. Ideal for quality control in various industries, SAM offers detailed imaging without radiation risks.

The Semi-Automatic Scanning Acoustic Microscope from SBT Ultrasonic Technology CO., LTD is a cutting-edge non-destructive testing tool that offers high efficiency and performance. With rapid scanning and high-resolution imaging, it can detect multi-layer defects in up to 1000 layers. The system features real-time display and analysis software for valuable insights into materials. Customizable with waterproof fixtures, the SAM-US302 model showcases SBT Ultrasonic Technology's commitment to providing advanced ultrasonic solutions across various industries.

Wafer-Level Scanning Acoustic Microscope-High-Resolution NDT Inspection for Advanced Semiconductor Packaging

Engineered for precision and reliability, our Wafer-Level Scanning Acoustic Microscope (SAM) delivers non-destructive subsurface imaging for advanced semiconductor manufacturing, wafer-level packaging (WLP), and MEMS devices. Utilizing high-frequency ultrasonic waves, this system accurately detects micro-defects—such as internal delamination, voids, micro-cracks, and bonding anomalies—without damaging the sample.

Driven by the boom in global AI and cloud computing, traditional air cooling falls short for high-power data centers. The reliability of internal microchannels in liquid cold plates—the core system component—is paramount. Any minute defect, such as incomplete brazing, cracks, or channel blockages, can trigger long-term coolant leaks and costly chip failures. SBT ULTRASONIC’s Multi-Channel Ultrasonic Inspection System delivers a highly efficient, precise NDT (Non-Destructive Testing) solution to this industry-wide challenge.

The fully automated acoustic microscopes from the Auto SAM Wafer 304 enable fast detection of cavities, voids, bubbles, inclusions, and delamination and are ideally suitable for wafer inspection, bond checking, and MEMS inspection. An automatic defect-review software package performs a fully automated evaluation of the entire wafer. 

Engineered for reliability and precision, the SBT Ultrasonic Standard SAM provides industry-leading non-destructive ultrasonic imaging for microelectronics, materials science, and quality control.

High-Resolution Acoustic Imaging: Easily detects internal micro-defects, cracks, and bonding failures.

Non-Destructive Testing (NDT): Evaluates internal structures without altering or damaging the sample.

User-Friendly Workflow: Streamlined software interface for rapid scanning, data analysis, and high-throughput inspection.

The SBT Auto SAM was specially developed for the production control of electronic devices, boards, IGBTs(HPD or ED3), and other complex components. The systems conform to cleanroom class 10. The primary application involves verifying defects such as gaps, bubbles, holes, inclusions, delaminated areas, or thickness variations in soldered or Ag-sintered interfaces. Multiple layers can be inspected simultaneously.

The SBT Scanning Acoustic Microscope (SAM, SAT) uses high-frequency ultrasonic waves  to detect the internal structure, defects, and materials of objects. It is widely used in materials science, biomedical, electronic industry, and other fields, helping users achieve fast and accurate non-destructive testing.