SEMICON Europa 2024

SBT Ultrasonic to Showcase Cutting-Edge Ultrasonic Solutions at SEMICON Europa 2024

SBT Ultrasonic, a leader in ultrasonic technology, is excited to announce its participation in SEMICON Europa 2024, taking place from November 12-15 at the Trade Fair Center in Munich, Germany. This premier event is a significant platform for industry professionals, showcasing the latest advancements and innovations in the semiconductor industry.

At SEMICON Europa 2024, SBT Ultrasonic will present its latest ultrasonic solutions, including:

• Wire Bonder: Ensuring high-quality connections with precision and reliability.
• C-SAM/SAT:  Non-destructive quality control method.
• Pin Ultrasonic Welder: Delivering efficient and robust assembly solutions.
• Terminal Ultrasonic Welder: Facilitating secure and durable joint formations.
• Ultrasonic Dry Cleaner: Providing superior cleaning solutions for semiconductor components.

We invite you to visit us at Booth C2172 to explore our innovative technologies and discuss how SBT Ultrasonic can help enhance your manufacturing processes. Our team of experts will be on hand to provide insights and answer any questions.

Join us at SEMICON Europa 2024 to discover how we are shaping the future of the semiconductor industry with our advanced ultrasonic solutions.