SBT Wins Bulk Orders for Wire-Bonding Machines from Top-Tier Semiconductor Client

SHANGHAI, June 20, 2025-- Sbt Ultrasonic Technology Co., Ltd.(688392.SS) today announced receipt of multiple new purchase orders for itswire bonding machines and has also successfully shipped its Pin Ultrasonic Welder and Scanning Acoustic Microscope(SAT) to a key client.

As the leading ultrasonic technology company in China, SBT has achieved full self-sufficiency in ultrasonic systems through sustained heavy R&D investment. The company has independently developed breakthrough technologies including precision bonding, precision transfer, high-frequency pulse generators, high-precision Transducers, and high-speed DAQ cards, enabling complete in-house R&D and supply of core components and turnkey equipment.

Within the power semiconductor sector, SBT delivers a comprehensive product portfolio covering critical packaging processes such as:

 • Die attach

 • Wire bonding

 • Ultrasonic welding for signal terminals

 • Ultrasonic non-destructive testing (NDT)

As core components in electric vehicles (EVs) and renewable energy systems, SiC (silicon carbide) and IGBT (insulated-gate bipolar transistor) power modules demand extreme reliability, thermal efficiency, and current-carrying capacity—particularly under high-voltage fast-charging and 800V e-drive scenarios.

SBT collaborates with most Chinese power semiconductor manufacturers, providing ultrasonic bonding and inspection equipment for power modules, and has accumulated extensive application expertise.

Wire Bonder

Demonstrates exceptional process compatibility and production stability.

 • Supports diverse bonding media: heavy-gauge Cu wire, Cu ribbon, heavy Al wire, and Al ribbon

 • Meets automotive-grade (IATF 16949) and industrial packaging requirements

 • Secured volume orders from Tier-1 customers

Pin Ultrasonic Welder

Ultrasonically bonds pins, holders, and press-fit pins to DBC (Direct Bonded Copper) substrates, replacing conventional soldering.

 • 2-4x stronger weld strength vs. soldering at equivalent joint areas

 • Maximizes inter-facial connection integrity

 • SBT pioneered ultrasonic welding technology adoption in semiconductor manufacturing

SiC/IGBT Terminal Ultrasonic Welder

Bonds copper terminals (pins) to substrates with industry-leading reliability.

 • Eliminates sintering steps for select SiC applications

 • Solves substrate cracking – key industry pain point

 • Compatible with DSC/SSC/DCM/T-PAK modules

Scanning Acoustic Microscope (SAM)

Detects internal defects in power modules, ceramic substrates, IC packages, and BGAs.

Multi-scanning modes: A-Scan, B-Scan, C-Scan, T-Scan

Multi solutions: Benchtop, semi-auto, fully automated

Advanced packaging portfolio:

2.5D/3D Advanced Packaging SAM

Ultrasonic Die Bonder (for DTS, TCB, Flip-chip, etc.)

SBT’s proven technology and reliability have earned trust from leading global semiconductor manufacturers, driving significant market share gains in the competitive packaging equipment sector.