SBT Wafer Level SAT: Ideal for Detecting Defects in Bonded Wafers
SBT's self-developed Wafer Level Sat (Scanning Acoustic Tomography）for2.5D/3D advanced packaging has achieved another successful shipment! This independently developed semiconductor advanced equipment from SBT ensures chip yield through high-precision non-Destructive Testing, providing crucial support for the AI chip industry chain with its cutting-edge technology.
From July 26th-29th, 2025, the 2025 World AI Conference & High-Level Meeting on Global AI Governance (WAIC 2025) was held in Shanghai, with the theme "Global Solidarity in the AI Era", comprehensively showcasing the cutting-edge technologies, industrial trends of AI, as well as the latest practical achievements in global governance.
In fields such as AI and high-performance computing (HPC), 2.5D/3D advanced packaging technology has become a key path to break through the limitations of Moore's Law by stacking multiple chips and interposers. However, the complex three-dimensional structure of advanced packaging brings potential defect risks. AI high-performance chips (such as GPU and DPU) have extremely high requirements for packaging density and signal transmission speed. Tiny defects at the bonding interface (such as voids and delamination) may lead to reduced chip performance or even failure, seriously affecting chip reliability and lifespan.
Traditional testing methods (such as AOI and X-Ray) are difficult to meet the accurate testing needs of multi-layer structures. In contrast, acoustic inspection (SAT/C-SAM) has shown multiple advantages in defect detection of advanced packaging and wafer-level packaging, and is widely adopted.
High imaging resolution: Precisely locate defects through sound wave reflection, with accuracy reaching the micron level.
Wide material adaptability: Sensitive to non-metallic materials, capable of detecting uneven glue curing, poor silicon wafer bonding, etc.;
3D tomography: Provide layered imaging, locate defect depth, and evaluate interface bonding strength.
As a leading listed company in ultrasonic equipment, SBT (Stock Code: 688392,SH) has independently developed 2.5D/3D advanced packaging SAT (ultrasonic bubble detection equipment). It has overcome key technical challenges in high-frequency acoustic wave generation, signal processing, and imaging algorithms, and realized full-stack independent research and development of key core components such as high-frequency pulse generators, high-frequency precision ultrasonic components, and high-speed data acquisition cards.
SBT Wafer Level SAT: Wafer400-A4
SBT Ultrasonic Launches Wafer Level SAT Series (Ultrasonic Bubble Detection Equipment) -- Wafer400 -- Upgraded from Wafer300 Series. Capable of testing 6-inch, 8-inch, and 12-inch wafers, the series offers versatile solutions including the online fully automatic Wafer400-A4 and the offline semi-automatic Wafer400-B2 to meet diverse customer needs. Key performance rivals international first-tier brands, with breakthroughs in scanning efficiency, software algorithms, and intelligence.
SBT Wafer Level SAT
Shortly before WAIC 2025, SBT announced another success: multiple models of the Wafer400 series were successfully shipped! This not only confirms the delivery capability of SBT but also focuses market attention on its strong strength in the semiconductor field. From laboratories to Fab factories, SBT is facilitating the development of the chip industry chain with its independently innovated "ultrasonic eyes".
In the field of semiconductor packaging equipment, SBT's products cover processes such as die bonding, wire bonding, pins welding, terminals welding, and non-destructive testing (NDT) for advanced packaging, wafer-level packaging, and traditional packaging, providing fully independently developed solutions.
In the future, SBT will continue to deepen ultrasonic technology research and application, contribute to the innovation and development of the global semiconductor industry chain, and write a new chapter in the advancement of high-end semiconductor equipment through independent R&D and production capabilities.