SBT Ultrasonic Ships 2.5D/3D Advanced Packaging Ultrasonic Scanning Microscopes, Empowering Semiconductor detecting Technology Innovation

Recently, SBT Ultrasonic officially delivered its wafer-level ultrasonic scanning microscopes (SAT) to clients. Developed specifically to address the challenges of advanced packaging detection, this equipment marks a significant technological breakthrough in acoustic detection.

I. Advanced Packaging: The Key to Chip Performance Breakthroughs in the Post-Moore Era

As Moore’s Law approaches its physical limits, relying solely on process node scaling no longer meets the growing demand for computing power. Advanced packaging technologies, such as 2.5D/3D integration, have emerged as the new frontier for the semiconductor industry.From smartphones to AI servers, and from autonomous driving to high-performance computing, 2.5D/3D packaging has become the core solution for improving chip integration and reducing power consumption—dubbed “the engine of the post-Moore era.”
However, the complex three-dimensional structures introduce potential defect risks. In multi-layer stacked 2.5D/3D packaging, micro-cracks, bubbles/voids, or interfacial delamination can severely impact chip reliability and lifespan. These defects, often hidden within the packaging, are difficult to detect using traditional optical detection methods. Ultrasonic scanning microscopy (SAT), with its non-destructive, high-resolution capabilities, has become the indispensable tool for ensuring advanced packaging quality.

Ⅱ.Sbt Ultrasonics: Breaking Key Challenges Through Independent Innovation

As a leading listed company in ultrasonic equipment in China,SBT has accumulated 18 years of technical expertise,supported by 385 valid intellectual property rights.SBT has established an ultrasonic technology platform spanning theoretical foundations,core components,and product development,achieving breakthroughs in fundamental research areas such as piezoelectric composite materials and high-frequency pulse electronic circuits.

The newly launched 2.5D/3D advanced packaging ultrasonic scanning microscope,addresses critical technical challenges in high-frequency acoustic wave generation,signal processing,and imaging algorithms:

Hardware Breakthroughs: By assembling elite talent from top universities, SBT independently developed critical components including high-frequency pulse generators, high-precision ultrasonic transducers (probes), and high-speed data acquisition cards, achieving full autonomy in the overall system and core components.
Software Innovation: Rapid and high-precision imaging algorithms and AI-powered analysis systems enable automated defect quantification (size, area, percentage) and generate actionable evaluation reports.
High-Frequency Imaging:75-230MHz ultrasonic waves detect micron-level defects.
Multi-Mode Scanning: Supports A/B/C-scan and layer-by-layer analysis to pinpoint interlayer defects in 2.5D/3D packages.
Efficient Detection:Multi-probe zonal scanning technology enhances detection efficiency.

SBT’s 2.5D/3D SAT systems are now in mass production, offering advanced packaging manufacturers cost-effective, localized solutions.Looking ahead, we will continue to focus on detection demands for emerging technologies such as Chiplet, HBM memory, and CoWoS, continuously upgrading and iterating its systems and core components.