SBT Ultrasonic Launches Next-Generation Ultrasonic Die Bonder SDB-300
Shanghai, August 13, 2026 — Sbt Ultrasonic (Stock Code: 688392), a leading provider of high-end ultrasonic equipment, today unveiled the SDB-300, its next-generation ultrasonic die bonder designed for high-precision assembly of RF modules, MEMS, memory, and driver ICs. Combining flip-chip and thermosonic bonding processes, the system is particularly suited for gold-bump applications. Leveraging innovations in acoustic systems, ultrasonic bond heads, and thermal control, the SDB-300 delivers high-speed, high-precision bonding with significant gains in throughput and yield.
SDB-300: Built for High-Speed, High-Precision Die Attach
Built on SBT Ultrasonic's comprehensive core ultrasonic technology platform, the SDB-300 addresses the demanding requirements of advanced packaging with high-speed, high-precision ultrasonic bonding.
Featuring a compact, integrated thermosonic flip-chip architecture, the system supports both flip-chip and thermosonic processes. It is compatible with 6-, 8-, and 12-inch wafers, waffle packs, and tape-and-reel feeders, making it ready for high-volume manufacturing.
• 360° Full-Range Ultrasonic Head: Equipped with an all-new 360° full-range rotary ultrasonic bond head, enabling die placement at any angle without blind spots and accommodating irregular, high-density chips.
• Upgraded Acoustic System: Enhances oxide-layer removal at the bonding interface, delivering improved bond strength and exceptional batch-to-batch consistency.
• Low-Thermal Stress Control: Adopts an integrated closed-loop heating architecture. Substrate preheating requires only 100°C, while die-side temperature is kept below 200°C — a low-temperature process that minimizes thermal stress on heat-sensitive components.
• High Stability: Full closed-loop monitoring of force, displacement, and ultrasonic amplitude further elevates placement accuracy and ensures long-term production stability.
Empowering Advanced Packaging with Ultrasonic Excellence
SBT Ultrasonic is committed to delivering high-end ultrasonic equipment and services to semiconductor packaging customers worldwide. Its product portfolio spans ultrasonic die bonding, wire bonding, and ultrasonic inspection (C-Sam/SAT), covering die attach, interconnect, and non-destructive inspection across the packaging workflow.
The introduction of the SDB-300 strengthens SBT Ultrasonic's position in the high-end die-attach equipment market. It reinforces its ultrasonic equipment lineup for advanced packaging, providing customers worldwide with core manufacturing tools that drive quality and efficiency.
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• Sales: +86 15901603231
• Email: marketing@sbt-sh.com
• Website: www.sbt-ultrasonic.com
• Address: 1488 Cangyuan Road, Minhang District, Shanghai, China