SBT Ultrasonic Debuts Wafer400-F2 at SEMICON China: Solving Critical D2W Inspection for 2.5D Packaging

SHANGHAI, China – March 2026 – SBT UltrasonicTechnology Co., Ltd (SSE: 688392, "SBT"), a global leader in ultrasonic technology solutions for semiconductor manufacturing, officially launched its Wafer400-F2 Ultrasonic Inspection system atSEMICON China 2026. Engineered to resolve longstanding challenges in Die-to-Wafer (D2W) bonding defect detection, this next-generation system delivers high-precision non-Destructive Testing (NDT) capabilities to support high-volume manufacturing (HVM) of advanced 2.5D packaging.

Technical Breakthrough: Wafer400-F2 Redefines D2W Inspection
The fully automated Wafer400-F2 incorporates an innovative wafer-flipping mechanism – a proprietary design enabling non-contact ultrasonic scanning from the wafer backside. This architecture eliminates die-side liquid exposure risks while leveraging SBT’s advanced ultrasonic technology to achieve sub-micron resolution imaging of bonding interface defects, including voids/bubbles, bonding misalignment, edge delamination, cracks, and contaminants. The system sets new benchmarks for defect sensitivity and process reliability in 2.5D D2W bonding.

Solving Industry-Critical D2W Inspection Bottlenecks

Driven by surging demand for AI accelerators, HBM memory, and other HPC applications, 2.5D/3D advanced packaging has become pivotal to semiconductor innovation. However, D2W bonding inspection has historically constrained HVM scalability due to limitations in accessing and characterizing bonding interfaces without damaging delicate structures. The Wafer400-F2 directly addresses this challenge by combining automated wafer flipping with high-precision ultrasonic imaging, enabling defect detection with unmatched accuracy while maintaining device integrity.

Schematic Diagram of the D2W Bonding Process

Comprehensive Advanced Packaging Inspection Portfolio
SBT's expanded product matrix addresses full-spectrum advanced packaging inspection requirements:

• Wafer400-F2 (New Release): Fully automated system optimized for 2.5D D2W bonding, compatible with W2W processes, featuring proprietary wafer-flipping inspection capabilities.
• Wafer400-A4 (Volume Production): Fully automated platform for W2W bonding, validated in global HVM environments.
• Wafer400 (Offline): Flexible offline system supporting both W2W and D2W inspection for R&D and low-to-medium volume production.

Global Technology Leadership
Founded in 2007 with academic roots at Shanghai Jiao Tong University, SBT Ultrasonic is the world’s first publicly listed semiconductor ultrasonic equipment specialist. We achieve full-stack development of core components – including high-frequency pulse generators, precision ultrasonic transducers, high-speed data acquisition systems, and AI-driven defect classification algorithms – supported by over 400 active patents. In 2025, SBT’s Wafer400 series achieved global HVM deployment, establishing the company among the few suppliers capable of delivering in-line, fully automated wafer ultrasonic inspection systems.

Market Impact and Future Roadmap
As AI-driven demand for high-end chips accelerates, advanced packaging is evolving toward higher interconnect density, larger wafer sizes, and heterogeneous integration. NDT systems have become critical enablers for yield optimization and HVM scalability. The Wafer400-F2 delivers performance comparable to industry-leading benchmarks while offering tailored solutions for advanced packaging HVM. SBT remains committed to advancing ultrasonic core technologies, aligning with evolving packaging technology roadmaps, and enhancing product performance and process compatibility to deliver competitive, end-to-end inspection solutions for global semiconductor customers.

Through strategic collaboration with global semiconductor stakeholders, SBT Ultrasonic aims to drive technological innovation and sustainable industry growth, empowering manufacturers to overcome advanced packaging inspection challenges and achieve new milestones in production efficiency and yield optimization.