SBT Ultrasonic Achieves Milestone with Bulk Delivery of 100 Wire Bonders to a Leading Domestic Semiconductor Client

Recently, SBT Ultrasonic (Stock Code: 688392) completed the bulk delivery of 100 wire bonders (Wedge Bonders) to a leading domestic semiconductor manufacturer. The equipment will be fully deployed across the client’s packaging production lines, accelerating the domestic substitution of core back-end packaging equipment.

As critical equipment in semiconductor back-end packaging, wire bonders (specifically wedge bonders) utilize Ultrasonic energy to create electrical interconnects and mechanical joints between chip pads and package substrates. The machine's bonding precision, process consistency, and long-term reliability directly dictate the package yield, current-carrying capacity, and thermal cycling lifetime of semiconductor devices.

Leveraging its profound expertise in ultrasonic technology, SBT Ultrasonic has independently developed wire bonding equipment covering both copper and aluminum wire processes, compatible with wedge bonding applications for 200–500 μm copper wire and 100–500 μm aluminum wire. Equipped with a digital ultrasonic generator system, precision motion control platform, high-resolution vision positioning system, and proprietary bonding process algorithms, the system integrates a non-destructive pull-testing module to achieve micron-level bonding accuracy and closed-loop quality control throughout the entire workflow, fully meeting the stringent demands of semiconductor clients for high reliability and stability.

The on-time delivery of these 100 wire bonders fully validates SBT Ultrasonic’s large-scale delivery capabilities across the entire chain—spanning supply chain collaboration, production management, quality validation, on-site commissioning, and after-sales support. With years of deep cultivation in the semiconductor equipment sector, the company has built a highly experienced team of R&D, process, production, and technical service experts. Bolstered by a comprehensive quality management system that aligns with semiconductor industry standards, SBT Ultrasonic is uniquely positioned to respond rapidly to clients' diverse needs, including production expansion, process iteration, and operational maintenance.

By extending its core ultrasonic technology across multiple platforms, SBT Ultrasonic has established a comprehensive product portfolio in the power semiconductor packaging sector, centered on four core product lines: Wire Bonders, Pin Ultrasonic Welders, Terminal Ultrasonic Welders, and Scanning Acoustic Microscopes (C-SAM/SAT). These products fully cover critical back-end packaging processes, including die interconnects, component welding, and non-destructive testing (NDT). This enables the company to offer integrated equipment solutions that span ultrasonic welding and ultrasonic testing, providing comprehensive support to clients as they transition to domestic upgrades and capacity expansion.

Looking ahead, SBT Ultrasonic will continue to deepen its expertise in core ultrasonic technology, iterate and refine its bonding equipment portfolio, and expand its strategic footprint in the semiconductor and advanced packaging sectors. The company remains committed to providing industry clients with more efficient and reliable integrated packaging and inspection equipment solutions.

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