SAM for 2.5D/3D Advanced Packaging: Discover SBT ULTRASONIC at SEMICON Taiwan 2026

As advanced packaging technologies evolve toward larger formats and higher integration, quality control becomes exponentially more challenging. One of the most critical inspection tools behind the scenes is SAM – Scanning Acoustic Microscope. But what exactly is Sam, and why is it indispensable for next-generation packaging like FOPLP?

SAM is a non-destructive testing method that uses high-frequency ultrasound to image internal structures of materials. It detects discontinuities such as voids, cracks, delamination, and inclusions by sending sound waves into the sample and analyzing reflected signals. Unlike optical inspection, SAM “sees” through opaque layers, making it uniquely suited for checking buried interfaces – like those in multi-layer redistribution layers (RDLs), solder joints, and mold compound – without damaging the device.

For next-generation advanced packaging – especially fan-out panel-level packaging (FOPLP) – SAM is becoming a non-negotiable process control tool. Panel-level substrates, often 300 mm×300 mm to 600 mm×600 mm, introduce new failure modes: edge/corner stress, CTE mismatch-induced warpage, and nonuniform adhesion. These defects cannot be reliably caught by surface inspection alone. SAM provides the volumetric insight needed to detect hidden anomalies early, feeding back critical data to improve yield in highvolume manufacturing (HVM).

Sbt Ultrasonic, a specialist in acoustic micro-imaging, has built a comprehensive ultrasonic inspection portfolio that covers wafer-level, packaging-level, and panel-level processes. In SEMI Taiwan 2026, our company highlights its PLP Ultrasonic Inspection Solution – purpose-designed for panel-level packaging. This system meets fab cleanroom standards, detects gaps, voids, holes, inclusions, delamination, and thickness variations at sintered or soldered interfaces, supports multi-layer simultaneous scanning, and handles panel sizes from 300 × 300 to 600 × 600 mm.

The SBT Ultrasonic portfolio can be configured as fully automated in-line, semi-automated offline, or manual offline setups, flexibly adapting to various HVM phases and process steps. On-site at the show, SBT’s technical and commercial teams are presenting the complete solution lineup. Visitors are invited to Booth P5612 for live demonstrations and to explore how SAM – powered by SBT ULTRASONIC – is redefining quality assurance for the next generation of advanced packaging.