Join SBT Ultrasonic at The Battery Show Europe & PCIM Europe 2026!
From June 9–11, 2026, Sbt Ultrasonic will simultaneously showcase its cutting-edge technologies at two of Europe’s premier events for the new energy and semiconductor industries: The Battery Show Europe in Stuttgart and PCIM Nuremberg.
We cordially invite global customers, partners, and industry experts to visit our booths. Come explore how our innovative Ultrasonic Welding and intelligent monitoring solutions can empower your production and drive a sustainable future!
📅 Event Details & Booth Locations
The Battery Show Europe
- Venue: Messe Stuttgart, Germany
- Booth: Hall 3 - Stand C74
PCIM Europe
- Venue: Messe Nuremberg, Germany
- Booth: Hall 5 - Stand 403
🔋 1. EV Battery Manufacturing & Intelligent Monitoring Solutions
- ⚡ Wedge Ultrasonic Metal Welder Engineered for multilayer, thick, and large-area tab connections in prismatic and pouch cells. Featuring a vertical wedge-reed structure, it minimizes horn deformation to deliver exceptionally stable and reliable welds.
- 🛡️ Ultrasonic Welding & Monitoring System Equipped with an online quality monitoring system that detects welding anomalies in real time. This system effectively prevents batch defects, reduces production costs, and optimizes yield.
- 🧬 Ultrasonic Plastic Welder Designed for high-efficiency sealing and structural bonding of battery plastic components across cell enshrouding, module, and PACK assembly. Delivering millisecond-level, high-hermetic welds with zero consumables, it is perfectly compatible with thermoplastics (PP, ABS, PC, etc.) while eliminating thermal damage and contamination risks.
- 🎯 Laser Welding Process Monitoring System (LWMS-20) By capturing real-time signals from plasma emission, laser back-reflection, and thermal radiation, this system precisely identifies laser welding defects, helping manufacturers eliminate batch production risks.
- 🔍 Laser Welding Penetration Depth Measurement System (OCTS-20) Utilizing Optical Coherence Tomography (OCT) with a coaxial optical design, this system correlates welding defects with keyhole depth stability. It captures real-time keyhole cross-sections and depth data to provide precise insights for process parameter optimization.
💻 2. Semiconductor & Power Module (IGBT/SiC) Packaging & Inspection- 🔬 Scanning Acoustic Microscope (C-SAM/SAT) A premier tool for non-destructive testing (NDT) of internal defects. It is widely applied in IGBT/SiC discrete devices, ceramic substrates, plastic-encapsulated ICs, optoelectronic devices, microwave power devices, MEMS, flip chips, MLCCs, and GPU liquid cooling plates.
- 🌐 Advanced Packaging Ultrasonic Scanning Inspection System (Wafer Level C-SAM/SAT) Tailored for 2.5D (such as CoWoS) and 3D packaging, as well as W2W and D2W wafer bonding defect inspection. Compatible with 6-to-12-inch wafers, it integrates seamlessly with factory MES/manufacturing systems and offers offline standard, semi-automated, and fully inline automated configurations to cover R&D, pilot runs, and high-volume manufacturing.
- 🧵 Heavy Wire Bonders (Copper, Aluminum, & Dual-Head) Engineered for ultrasonic wire bonding of heavy copper and aluminum wires in IGBT/SiC modules, PV/energy storage inverters, lasers, and automotive electronics, ensuring outstanding electrical connection performance.
- 📌 IGBT Terminal/Pin Ultrasonic Welder Specially designed for power terminals and pin connections in Si/SiC power modules. Serving as a high-precision, high-speed, and reliable alternative to traditional solder paste reflow processes.
🤝 Connect With Our TeamOur on-site technical experts and international sales team are looking forward to discussing your specific process challenges and tailoring the right solutions for your production lines.
📩 Leave a comment below or send us a direct message to book an on-site meeting in advance! Two shows, same team, see you in Germany!