ICEPT 2026: SBT Ultrasonic Debuts New Advanced Packaging Equipment

The rapid iteration of AI chips, HBM, and advanced packaging technologies is driving sustained growth in the semiconductor packaging equipment market. As indispensable core equipment in packaging processes, high-end die attach, bonding, and inspection systems have long been dominated by overseas suppliers, making them a critical bottleneck that China’s domestic packaging supply chain must urgently overcome to achieve self-reliance.

As a listed company, SBT Ultrasonic (Stock Code: 688392) has established itself among the global providers of advanced packaging Ultrasonic equipment, driven by strong R&D capabilities and successful mass-production validation at leading foundries.

At the upcoming ICEPT 2026 (International Conference on Electronic Packaging Technology), SBT Ultrasonic will showcase its comprehensive range of ultrasonic solutions at Booth C20. Covering both advanced and conventional packaging applications, the display features Ultrasonic Die Bonders (SDB Series), Wire Bonders (WB) and Scanning Acoustic Microscopy/Tomography (C-Sam/SAT) systems. Key flagship equipment on exhibit includes the SDB300 Ultrasonic Die Bonder, the Wafer400 Series Advanced Packaging C-SAM Systems, and the PLP600 Series Panel-Level C-SAM Equipment—fully addressing critical mainstream advanced packaging processes including HBM, CoWoS, 2.5D/3D heterogeneous integration, wafer-level packaging (WLP) and panel-level packaging (PLP).

Founded in 2007, SBT Ultrasonic currently employs over 1,100 people, with R&D personnel accounting for nearly 40% of its workforce. Bringing together top talents from premier universities such as Tsinghua University, Peking University, and Shanghai Jiao Tong University, the core R&D team brings 10 to 20 years of semiconductor equipment industry expertise. The company has accumulated over 400 authorized intellectual property rights and successfully mastered key underlying technologies, including high-frequency pulse generators, high-performance ultrasonic transducers, high-speed data acquisition modules, and precision motion control platforms.

With a well-rounded product line and field-proven process expertise, SBT Ultrasonic has forged a dual-engine development structure in semiconductor ultrasonic packaging equipment: pioneering technical breakthroughs in advanced packaging alongside market leadership in traditional packaging applications.

Within the advanced packaging segment, the company's automated Scanning Acoustic Microscopy (C-SAM) void detection systems have achieved successful site acceptance at premier semiconductor foundries, earning follow-on procurement. In traditional packaging, core equipment, including wedge bonders, pin and terminal ultrasonic welders, and standard C-SAM units have entered volume production at leading domestic OSAT facilities.

Leveraging a complete service platform, the company provides full-life cycle support—encompassing setup, process fine-tuning, and responsive maintenance—to secure production continuity and yield optimization for customers.

Going forward, SBT Ultrasonic remains dedicated to specialized semiconductor equipment, driving independent R&D and continuous technology upgrades to empower high-efficiency, top-quality, and innovative growth for the global semiconductor industry.