SBT nwetara nnukwu iwu maka igwe na-ejikọta waya sitere na ndị ahịa Semiconductor Top-Tier
SHANGHAI, Juun 20, 2025-- Sbt Ultrasonic Technology Co., Ltd.(688392.SS) taa kwuputara nnata nke otutu iwu ịzụrụ ọhụrụ maka ya.igwe njikọ wayama bupukwa ya nke ọma Pin Ultrasonic Welder na Mikroskopu Acoustic (SAT) na-enyocha nye onye ahịa isi.
Dị ka onye na-eduga ultrasonic technology ụlọ ọrụ na China, SBT enwetawo zuru onwe-eju afọ na ultrasonic usoro site na-adịgide adịgide R&D itinye ego. Companylọ ọrụ ahụ ewepụtala teknụzụ na-eme nke ọma n'onwe ya gụnyere njikọta nkenke, mbufe nkenke, ndị na-ebupụta mkpụrụ akụ dị elu, nkenke dị elu. Onye ntụgharịs, na kaadị DAQ dị elu, na-eme ka R&D zuru oke n'ime ụlọ yana inye ihe ndị bụ isi na akụrụngwa turnkey.
N'ime ngalaba semiconductor ike, SBT na-ewepụta Pọtụfoliyo ngwaahịa zuru oke na-ekpuchi usoro nkwakọ ngwaahịa dị oke mkpa dịka:
• Die tinye
• Njikọ waya
• Ultrasonic ịgbado ọkụ maka akara ngosi
• Nnwale Ultrasonic na-adịghị emebi emebi (NDT)
Dị ka isi ihe dị n'ime ụgbọ ala eletrik (EV) na sistemu ume ọhụrụ, SiC (silicon carbide) na IGBT (insulated-gate bipolar transistor) modul ike chọrọ ntụkwasị obi siri ike, arụmọrụ ọkụ, na ikike ibu ugbu a - ọkachasị n'okpuru nnukwu chaja ngwa ngwa na 800V e-drive ndapụta.
SBT na-arụkọ ọrụ na ọtụtụ ndị na-emepụta semiconductor ike China, na-enye ultrasonic bonding na nyocha ngwa maka modul ike, ma chịkọtala ọtụtụ ọkachamara ngwa.
Na-egosipụta ndakọrịta usoro pụrụ iche yana nkwụsi ike mmepụta.
• Na-akwado mgbasa ozi njikọ dị iche iche: eriri Cu wire, Cu ribbon, Al waya na Al ribbon
• Zutere ọkwa ụgbọ ala (IATF 16949) yana chọrọ nkwakọ ngwaahịa ụlọ ọrụ
• Iwu olu echekwara site n'aka ndị ahịa Tier-1
Ultrasonically na-ejikọta atụdo, ihe njide, na ntụtụ-adaba adaba na mkpụrụ nke DBC (Direct Bonded Copper), na-edochi ịgbazinye ihe.
• 2-4x ike weld siri ike vs. soldering na mpaghara nkwonkwo nhata
• Na-ebuli iguzosi ike n'ezi ihe njikọ dị n'etiti ihu
• SBT sụrụ ụzọ ultrasonic ịgbado ọkụ teknụzụ nkuchi na semiconductor n'ichepụta
SiC/IGBT Terminal Ultrasonic Welder
Na-ejikọta ọnụ ọnụ ọla kọpa (ntụtụ) na ihe ndị nwere ntụkwasị obi na-eduga ụlọ ọrụ.
• Na-ewepụ usoro ntughari maka ngwa SiC họrọ
• Na-edozi mgbawa mkpụrụ - isi ihe mgbu ụlọ ọrụ
• Dakọtara na modul DSC/SSC/DCM/T-PAK
Na-enyocha microscope Acoustic (SAM)
Na-achọpụta ntụpọ dị n'ime modul ike, ihe seramiiki, ngwugwu IC, na BGA.
Ụdị nyocha ọtụtụ: A-nyocha, B-nyocha, C-nyocha, T-nyocha
Multi ngwọta: Benchtop, ọkara akpaaka, zuru akpaghị aka
Pọtụfoliyo nkwakọ ngwaahịa dị elu:
2.5D/3D Advanced Packaging SAM
Ultrasonic Die Bonder (maka DTS, TCB, Flip-chip, wdg)
Teknụzụ egosipụtara na teknụzụ SBT enwetala ntụkwasị obi site n'aka ndị na-emepụta semiconductor zuru ụwa ọnụ, na-ebute uru ahịa dị ukwuu na mpaghara akụrụngwa nkwakọ ngwaahịa asọmpi.