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High-Reliability Ultrasonic Welding Solutions for Power Modules
Ultrasonic Welding Solutions for Advanced Power Electronics
In power electronics manufacturing, the assembly of high-performance power modules—such as IGBTs, IPMs, and SiC devices—increasingly relies on advanced ultrasonic welding technology. SBT ULTRASONIC systems deliver highly reliable, robust connections for both high-load current terminals and control signal pins, offering significant advantages over traditional soldering processes.
Superior Electrical Performance The solid-state molecular bonding formed by ultrasonic welding minimizes contact resistance, significantly reducing conduction losses and maximizing overall electrical efficiency.
Intelligent Process Control Our advanced platforms feature real-time, closed-loop control over critical parameters—including welding energy, amplitude, and pressure—backed by full data traceability to ensure flawless joint consistency.
Extended Lifespan & Reliability Accelerated lifetime testing demonstrates that power modules bonded with SBT ULTRASONIC technology exhibit superior thermal cycling performance. This significantly extends operational lifespan, simplifies thermal management designs, and guarantees long-term system reliability.
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Automotive Power Module with ultrasonically welder terminals and pins Automotive Power Module with ultrasonically welder terminals and pins
IGBT power module with ultrasonic welder IGBT power module with ultrasonic welder
60 x 8 Mil Copper Ribbon Bonding IGBT module for industrial application
DBC substrate with ultrasonic welder DBC substrate with ultrasonic welder
20 Mil Copper Wire Bonding 20 Mil Copper Wire Bonding
HPD-15 Mil Aluminum Wire Bonding HPD-15 Mil Aluminum Wire Bonding
IGBT module for industrial application HPD-15 Mil Aluminum Wire Bonding
Soldering of custom-shaped heavy-duty terminal modules Automotive Power Module with ultrasonically welder terminals and pins
Why Choose SBT ULTRASONIC Power Electronics Solutions?
  • Solid-state bonding technology eliminates voids and spatter
  • Enables ultra-low-resistance bonding for high-power-density modules
  • Fully closed-loop control of energy, pressure, and amplitude ensures process robustness
  • Compatible with copper wire (8–20 mil), aluminum wire(4-20 mil), copper ribbon, and specialized terminal geometries
  • Built-in bond quality monitoring and SPC data export capabilities, ideal for Industry 4.0 production lines
Got Technical Questions?
Talk to an expert about your power electronics requirements.

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