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High Performance Wedge Bonder-WB P602
Products
High Performance Wedge Bonder-WB P602 1.png
High Performance Wedge Bonder-WB P602.png

High Performance Wedge Bonder-WB P602

WB P602 wedge bonder is driven by a new powerful direct-drive motion system and expanded pattern recognition capabilities which deliver industry leading productivity and reliability. It provides dual-head configurations.

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    INTRODUCTION

    WB P602 is the perfect choice for bonding TO power devices

    FEATURES

    High Performance Wedge Bonder-WB P602 1
    01
    0.5 μ m resolution linear motor.
    GBS helps shorten the replacement time of cutting tools and other consumables, ensuring consistency.
    ALC function.
    Aluminum strip bond head is optional.
    Online non-destructive testing Pull Tester is optional.

    APPLICATION

    For aluminum wires or ribbons bonding of IGBT Module,  automotive electronics, high power photoelectric sensor, power battery.

    PARAMETERS

    Dimensions 1880×1145×1710mm
    Weight ≈1200kg
    Wire Range 100 - 500um (4 - 20mil)
    Bonding Area 50×100mm, resolution = 0.1μm
    Lead Frame 135 - 300(mm), 20 - 100(mm)
    Z - axis Linear motor, stroke: 50mm, resolution = 0.1μm
    R - axis Linear drive, stroke: ±220°, resolution = 0.0057
    Bonding Force 50 - 1500g, programmable
    Pull Test ALC 50 - 500g, programmable