Heavy Copper Wire Bonding: Everything You Need to Know

SBT Ultrasonic Technology Co., Ltd. is proud to present our latest innovation in wire bonding technology – Heavy Copper Wire Bonding, Our Heavy Copper Wire Bonding process is designed to meet the increasing demand for high current-carrying capacity and thermal dissipation in electronic devices. By using thicker copper wires for bonding, our technology allows for improved power efficiency and reliability in applications such as power modules, automotive electronics, and high power LED lighting, With our advanced ultrasonic bonding technology, we ensure a strong and secure bond between the heavy copper wire and the substrate, resulting in excellent electrical and thermal conductivity. Our process also offers the flexibility to bond heavy copper wires to a variety of materials including aluminum, ceramic, and PCB substrates, SBT Ultrasonic Technology Co., Ltd. is committed to providing cutting-edge solutions for the semiconductor and electronics industry, and our Heavy Copper Wire Bonding technology is a testament to our dedication to innovation and excellence. Contact us today to learn more about how our technology can benefit your specific application needs