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Heavy Aluminum Wire Bonder - Bonding Wires and Ribbons

Wedge Bonders

Heavy Aluminum Wire Bonder - Bonding Wires and Ribbons

SBT ULTRASONIC is the leading company in China specializing in wire and ribbon bonding for power semiconductors and automotive power modules. We help you overcome numerous technical challenges in electronics applications while simultaneously reducing costs.
Our SBT Copper Wire Bonder utilizes ultrasonic technology to bond round copper wires with diameters ranging from 200 to 500μm (8-20 mils), as well as copper ribbons up to 80 x 8 mils in size.
For over 17 years, SBT ULTRASONIC welding machines have been recognized for exceptional performance, reliability, and excellent after-sales support. SBT Wire Bonders are created to cater to industries' needs of smaller, thinner, and denser semiconductor packages.
All the core components, such as transducers and generators, can be independently developed by ourselves.

    INTRODUCTION

    The SBT Heavy Aluminum Wire Bonder belongs to the new generation of ultrasonic wedge-wedge bonders, designed specifically for the fully automated processing of a broad spectrum of large-sized substrates, chips, and automotive applications (such as batteries), among other purposes. It is versatile and can be utilized for both wire and ribbon bonding in power semiconductors and automotive power modules.

    A switch from aluminum to copper can be accomplished within minutes. As the technology leader in China, SBT ULTRASONIC has designed the only heavy wire bondhead equipped with a non-destructive pull test and a unique transducer-integrated sensor, enabling 100% quality monitoring in real-time. Advanced features available on the Heavy Aluminum Wire Bonder is designed to meet your present and future requirements and greatly enhance productivity.

    FEATURES

    Heavy Aluminum Wire Bonder-Leftq20
    01
    7 Jan 2019
    Expanded bond area (300 x 300 mm), Y-axis: customized
    Gantry double drive structure, X/Y axis can be accelerated
    Marble platform, more stable
    Welding quality online monitor
    Nondestructive tensile testing(ALC)
    Magnetic spring compensation technology
    High pixel GBS device
    Low maintenance requirements
    User-friendly software

    APPLICATION

    The SBT Heavy Aluminum Wire Bonder offers high performance for both wire and ribbon bonding in power semiconductors, automotive power modules and batteries.
    15mil-Aluminum-Wire-Bonding-on-HPD0f5
    15mil-Aluminum-Wire-Bonding-on-HPD(2)phu

    PARAMETERS

    Bonding capability Aluminum wire: 4~20mil (100-500μm)
    Aluminum ribbons: 500×100μm - 2000×300μm in cross-section
    Frequency 80±1.5kHz/60±1.5kHz
    X/Y axis Linear motor, Resolution: 0.1μm, Repeatability: ±3.0μm at 3σ
    Bonding area 300*300㎜², Y-axis is customizable
    Z-axis Circular linear motor, 50㎜, 0.1μm resolution
    Rotation-axis Servo motor, stroke±220°, resolution 0.0096°
    Loading system Fully open size: 710㎜(D)×460㎜(H)
    Half open size: 710㎜(D)×225㎜(H)
    Field of vision 9.6㎜×7.2㎜, 0.014㎜/LP
    Welding force Programmable: 50-5000g, accuracy: <175g, ±5g. >175g, ±3%