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Heavy Aluminum Wire Bonder - Bonding Wires and Ribbons-1
Ultrasonic Wire Bonder
Dual-Head Aluminum Wire Bonder.png
Dual-Head Aluminum Wire Bonder_1.png

Heavy Aluminum Wire Bonder - Bonding Wires and Ribbons-1

The SBT Ultrasonic Dual-Head Aluminum Wire Bonder is designed for efficient, high-quality wire bonding in power semiconductor and module assembly. Featuring two independent bonding heads, it significantly improves throughput while maintaining precise and consistent connections for aluminum wire. Ultrasonic technology ensures strong, reliable bonds without excessive heat, protecting sensitive components. Ideal for production environments requiring both speed and repeatability, this system delivers stable performance for heavy aluminum wire sizes commonly used in automotive, industrial, and power electronics applications.

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    INTRODUCTION

    Designed specifically for power device manufacturing, this dual-head ultrasonic wire bonder delivers exceptional bonding speed and consistency for aluminum wires. The advanced ultrasonic technology ensures reliable, low-temperature bonding, reducing thermal stress on sensitive power modules and discrete semiconductors. Each bond is precise and repeatable, making the system ideal for high-volume production lines where both efficiency and yield matter.

    It handles a wide range of aluminum wire sizes commonly used in automotive, industrial, and renewable energy power electronics. With robust construction and intuitive controls, it offers dependable performance shift after shift.

    FEATURES

    Dual-Head Aluminum Wire Bonder_1
    01
    XYZR fully direct-drive
    Fully automatic loading and unloading of material trays
    Opting for GBS helps shorten the replacement time for consumables such as cutting blades and ensures consistency
    Standard ALC functionality
    Optional aluminum bond head
    Optional online non-destructive pull tester
    Low maintenance requirements
    User-friendly software

    APPLICATION

    Discrete Devices 
    TO packages (TO-247, TO-220, TO-263, etc.) – Heavy aluminum wire bonding from chip to leads.
    SO-8 – Typically uses finer aluminum wire for smaller power ICs.
    PDFN (Power DFN) – Low-profile power packages requiring precise, low-heat ultrasonic bonding.
    Power Modules 
    SPM (Smart Power Module) – Integrated power + drive circuitry; aluminum wire bonds connect IGBTs/diodes.
    APM (Advanced Power Module) – High-density modules for automotive/industrial; dual-head boosts throughput.
    IPM (Intelligent Power Module) – Often used in motor drives & inverters;
    requires consistent, reliable wire bonding for high-current paths.
    15mil-Aluminum-Wire-Bonding-on-HPD0f5
    15mil-Aluminum-Wire-Bonding-on-HPD(2)phu

    PARAMETERS

    Bonding capability Aluminum wire: 4~20mil (100-500μm)
    Dimensions 1860mm(W)*1140mm(D)*1720mm(H)
    X/Y axis Linear motor, Resolution: 0.1μm
    Bonding area 80mmx80mm
    Z-axis Circular linear motor, travel range: 50mm, 0.1μm resolution
    R-axis Direct drive, travel range: ±220°, resolution: 0.0057°
    Total power ≤2.5KW
    Tray dimensions 115 ≤ length ≤ 305 mm, 21 ≤ width ≤ 110 mm, height ≤ 200 mm
    Welding force  50-1500g (programmable)