Wedge Bonders
Copper Wire Wedge Bonder - Bonding Wires and Ribbons
INTRODUCTION
The SBT Copper Wire Wedge Bonder belongs to the new generation of ultrasonic wedge-wedge bonders, designed specifically for the fully automated processing of a broad spectrum of large-sized substrates, chips, and automotive applications (such as batteries), among other purposes. It is versatile and can be utilized for both wire and ribbon bonding in power semiconductors and automotive power modules.
A switch from aluminum to copper can be accomplished within minutes. As the technology leader in China, SBT ULTRASONIC has designed the only heavy wire bondhead equipped with a non-destructive pull test and a unique transducer-integrated sensor, enabling 100% quality monitoring in real-time. Advanced features available on the Heavy Copper Wire Bonder is designed to meet your present and future requirements and greatly enhance productivity.
FEATURES
01
7 Jan 2019
Expanded bond area (300 x 300 mm), Y-axis: customized
Gantry double drive structure, X/Y axis can be accelerated
Marble platform, more stable
Welding quality online monitor
Nondestructive tensile testing(ALC)
Magnetic spring compensation technology
High pixel GBS device
Low maintenance requirements
User-friendly software
APPLICATION
The SBT Copper Wire Wedge Bonder offers high performance for both wire and ribbon bonding in power semiconductors and automotive power modules.
PARAMETERS
| Bonding capability | Copper wire: 8~20mil (200-500μm)
Copper ribbons: ≤80x8 mil in cross-section |
| Frequency | 80±1.5kHz/60±1.5kHz |
| X/Y axis | Linear motor, Resolution: 0.1μm, Repeatability: ±3.0μm at 3σ |
| Bonding area | 300*300㎜², Y-axis is customizable |
| Z-axis | Circular linear motor, 50㎜, 0.1μm resolution |
| Rotation-axis | Servo motor, stroke±220°, resolution 0.0096° |
| Loading system | Fully open size: 640㎜(D)×310㎜(H) |
| Welding option | Front cutting or back cutting |
| Welding force | Programmable: 50-5000g, accuracy: ＜175g, ±5g. ＞175g, ±3% |