Products
Auto SAM Wafer 304-Wafer Inspection
INTRODUCTION
The Auto SAM Wafer 304 is product line specially developed for inline production control. It conforms to cleanroom class 10 and was designed for the inspection of wafers or bonded wafers (MEMS) to detect cavities, inclusions, or delamination in bonded layers.
The Auto SAM Wafer 304 is a fully automated system featuring robotic wafer handling, inspection, and judgment capabilities. It has a proven track record in continuous operations across numerous mass production lines.
FEATURES
01
7 Jan 2019
Automatic ultrasonic scanning
Meets class 1-10
Multi-probe ultrasound scanning
High resolution and sensitivity
Adapt to standard communication software
APPLICATION
The Auto SAM Wafer 304 was designed for the inspection of wafers or bonded wafers (MEMS) to detect cavities, inclusions, or delamination in bonded layers.
PARAMETERS
|
Application |
4” , 6”, 8”, 12”wafers or bonded wafers (MEMS) |
|
Dimension |
2400x2000x1300㎜ |
|
Transducers |
Four transducers, customizable |
|
Resolution |
1～4000 μm |
|
Bandwidth |
1-500 MHz |
|
Scanning Settings |
High precision scanning, fast scanning |
|
Platform |
Marble platform |
|
X/Y axis |
Linear motor, gantry double drive |
|
Max Scanning Speed |
2000mm/s |
|
Max acceleration |
2G/s |
|
Frequency |
1~300MHz |
|
Fixture |
Dedicated to wafer, customizable |
|
Auto Loading and unloading |
Customizable |